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Gas Type Wafer Biscuit Processing Line GG-15
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  • Gas Type Wafer Biscuit Processing Line GG-15
  • Gas Type Wafer Biscuit Processing Line GG-15
  • Gas Type Wafer Biscuit Processing Line GG-15
moveright

Gas Type Wafer Biscuit Processing Line GG-15 - |price|video|manufacturer|for sale|-GELGOOG

  • MOQ:1
  • Certification: CE
  • Supply Ability: 100 sets per month
  • PAY METHOD: WEST UNION L/C T/T CASH
  • LOADING PORT: Qingdao port

Application

professional produce the wafer with different size.

Main Feature

Fully automatic,gas heating type,advanced structure,lower power consumption.
Features
This wafer biscuit production line need at least ten machines:Electric electric heating oven(most important part);splicing machine;wafer sheet cooling machine(runs slowly to cool down and convey the wafer block);cream spreading machine;wafer cutting machine(the size can be customized by customers’ requirements);blender machine;cream mixer;swashing machine;sugar grinder;air compressor etc.If customers have some machines before,we can match others to meet their requirements,for example:wafer biscuit packing machine.
The cutting size can be customized by customers’ requirements.Also,we can change the voltage for customers.
 
Advantages:
1.The blender machine is the mixing system, the first technology processing equipment in wafer manufacturing. It adopts the separate delivery and automatic circulation system.
2.As to the most important part:Baking oven.Unanimous heat colors of wafer block. Thanks to the scientific selection of heating components, superior material selection for baking plate and reasonable die carrier structure, the heat colors of the center and periphery of the wafer block having been baked are unanimous.
3.High rate of certified products with finished product rate of not less than 98%. Because of uniform heating and unanimous heat colors, the demoulding rate of biscuit is high with improving rate of certified products accordingly. 
4.About the wafer sheet cooling machine:Materials: The machine frame is made of steel with international standard and the cover adopts imported 304 stainless steel plate with thickness of 1.2mm and Φ6 stainless raw material.The machine runs slowly to cool down and convey the wafer block.
Technical Data
Wafer Biscuit Baking Oven:
Model GGDL-15-1
Moulds quantity  15
Moulds size  470*325*25mm 
Size of wafer stripe 3.0*3.0*0.5
Wafer thickness 2.0-3.0mm
Baking time 95~120 seconds(the thickness of wafer<2.5mm)
Capacity 560 pieces/h(the thickness of wafer:2.3mm)
Component materials in contact with food  304 # stainless steel or cast iron
Average Power 1.5kw
Gas consumption  About 40m3/h
Dimension 3260*1560*2320mm
Weight 5700kg
 
FAQ
1.Q:can I get some samples?and what is the delivery time?
A:we are honored to sent you samples for quality check.for delivery time,10-20 days after confirm the sample order.
2.Q:do you have the products in stock?
A:Yes,we have some model products can supply to you.
3.Q:can I mix different modles in one container?
A:yes,different modles can be mixed in one container,but the quantity of each model should not be less than MOQ.
4.Q:how does your factory do regarding quality control?
A:Quality is priority,we always attach great importance to quality control from the very beginning to the end of   the production,every product will be fully assembled and carefully tested before it's packed for shipment.
5.Q:what's is your warranty terms?
A:we offer different warranty terms for different products,please contact with us for detailed warranty terms.

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